Qualcomm has denied rumours that its new Snapdragon 8 Elite Extreme Gen 6 chip is overheating, which emerged after reports from South Korea suggested Samsung is considering using its own Exynos 2700 in the upcoming Galaxy S27 Ultra specifically due to thermal issues with Qualcomm's solution.

According to these unofficial reports, Samsung has encountered difficulties with overheating during internal testing of Qualcomm's latest SoC. The Snapdragon 8 Elite Extreme Gen 6 is allegedly so hot that it triggers thermal throttling, automatically reducing the operating clock speed to prevent overheating. Samsung's Exynos 2700 reportedly did not exhibit such problems during the same tests, fuelling speculation that the Galaxy S27 Ultra might use the Exynos 2700 instead of the Snapdragon.

Qualcomm's Chief Marketing Officer (CMO) denied these claims on the social media platform X. "Recent media reports about heating issues with the Snapdragon 8 Elite Extreme Gen 6 are inaccurate. We are proud of the innovations and strong momentum of our new generation flagship platform and continue to work closely with global device manufacturers to provide users with a premium experience," Qualcomm's CMO stated.

Qualcomm also notes that manufacturers independently tune SoC performance to achieve a balance between performance and power consumption, depending on the device and usage. They further emphasise that results from specific internal tests do not necessarily reflect the SoC's behaviour in final products.

The Snapdragon 8 Elite Extreme Gen 6 features two most powerful processor cores clocked at 5 GHz and six high-performance cores running at 4 GHz. Such frequencies present a challenge for smartphone cooling, especially during prolonged loads, which may explain why claims of overheating have surfaced.

There are currently no independent tests to confirm the alleged overheating issues, nor is there official confirmation that Samsung intends to abandon Qualcomm's SoC for the Galaxy S27 Ultra. The situation remains at the level of unofficial information and denials, with the final chip decision likely to be known only shortly before the device's launch.